Cooper interconnect offers superior products and services in a full portfolio of connector and cable assembly solutions. By then, copper interconnect has already become a standard process for high performance logic technology at ibm. In semiconductor technology, copper interconnects are used in silicon integrated circuits ics to reduce propagation delays and power consumption. Copper interconnect technology for the 32 nm node and. While copperlowk interconnects have served well, allowing for the creation of ultra large scale integration ulsi devices which combine over a billion transistors onto a single chip, the increased resistance and rcdelay at the smaller scale has become a significant factor. Chemical mechanical planarization cmp opportunity has grown as. In this book, a leader in the field describes advanced laser systems with lower radiation. Tapan gupta since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. Chemical mechanical planarization cmp opportunity has grown as the number of interconnect levels has increased. To this end, dipbased all copper interconnects have been demonstrated to be a viable approach to form electrical interconnects by sintering copper nanoparticles between the copper pillar and pad. Use cmp to remove the excess copper, leaving behind the upper level interconnect and the via between the upper and lower connects. The copper damascene process and chemical mechanical polishing. Select ion of ou r books inde xed in the boo k ci tation i ndex. He served as senior development engineer at sipex and rsm and was rotary foundation scholar at zenith radio corporation.
Copper was first introduced in leadingedge chips in 1998, and is rapidly being adopted by all major manufacturers for highend products. In this chapter, the deposition method of cu films and the interconnect fabrication with cu metallization are introduced. Copper interconnect technology is expected to be a key component in the quest to create more powerful. Interconnect technology and design for gigascale integration. Copper interconnect technology is expected to be a key component in the quest to create more powerful cpus and memory chips. In this chapter, the deposition method of cu films and the interconnect. Copper interconnect technology tapan gupta springer. Today most manufactors use silver, gold, or a mix of copper silver in thier high end cables. Then prices went through the roof and everyone started using copper to keep the prices reasonable. The material is unique in that it spans ic interconnect topics ranging from ibms revolutionary copper process to an indepth exploration into interconnect aware computer architectures. By october 2001, ibm shipped more than 25 million socalled copper chips.
Deposition technologies of materials for cuinterconnects. Copper interconnect technology spie tutorial texts in optical engineering vol. The material is unique in that it spans ic interconnect topics ranging from ibms revolutionary copper process to an indepth exploration into interconnectaware computer architectures. This book is jointly authored by leading academic and industry researchers. Since copper is a better conductor than aluminium, ics using copper for their interconnects can have interconnects with narrower dimensions, and use less energy to pass electricity through them. However, there are many challenges with implementation of cu interconnects at the 32 nm node and beyond, including increased resistivity, integration with porous lowk materials, and reliability. Buy copper interconnect technology 2009 by gupta, tapan isbn. Copper is sometimes specified as containing some percentage of pure copper, with the rest impurities. This text examines the role of copper in future interconnects, presents the range of problems involved, and explains how the solutions are being found. Copper interconnect technology request pdf researchgate.
The introduction of copper brought a shift to inlaid metal because copper is very difficult to etch, with nonpassivating, nonvolatile etch byproducts. One method for controlling the cleaning process with the cu dual damascene devices is to move from wet benches to spray tools or singlewafer cleaning systems. Lowtemperature dipbased allcopper interconnects formed by. This book addresses the major issues encountered with the use of copper for interconnection lines in microelectronics. Finding new materials for copper lowk interconnects is critical to the continuing development of computer chips. Finding new materials for copperlowk interconnects is critical to the continuing development of computer chips. It is an outstanding reference text that provides an excellent source of information on current copper interconnect technology and future possibilities. In high end cables, the coppers purity is important.
However, that was in 1997, when the industry was just coming to grips with the 0. Motorola followed closely the heels of ibm in pursuit of cu interconnect. Preliminary reliability evaluation of copperinterconnect metallization technology ashok k. Copper interconnects have gained wide acceptance in the microelectronics industry due to improved resistivity and reliability compared to al interconnects. It combines materials, technology, and applications to address the needs of the microelectronics researcher. The final step in the dual damascene patterning process is removal of the sin or sicn etch stop layer at the bottom of the via, using a fluorocarbon rie chemistry, such as cf 4 or chf 3. Advanced metallization conference was held june 4th through 7th in santa clara. The ceramic interconnect technology handbook goes beyond the traditional approach by first surveying the unique properties of ceramics and then discussing design, processing, fabrication, and integration, as well as packaging and interconnect technologies.
Copper interconnect technology spie tutorial texts in. To this end, dipbased allcopper interconnects have been demonstrated to be a viable approach to form electrical interconnects by sintering copper nanoparticles between the copper pillar and pad. Subsea interconnect visit the seatronics web site for contact information subsea supplies ltd, uk. Metal 1 copper lines in intels quartermicron logic process were 480 nm. Growth can be seen all over the world, with capacity going from less than 4,000 mw in the mid1990s to more than 70,000 mw today. D is chief materials scientist at radiation monitoring devices, a governmentfunded research organization.
It is apparent why the tin barrier material must also be conductive. The lengths of the local interconnect are of this order and are comparable to mean free path of electrons in cnt. With global manufacturing facilities, cooper provides solutions from concept design, prototyping, to the finished product. Learn about the materials science, fundamental principles and engineering technology necessary to effectively utilize copper cu interconnects. In semiconductor technology, copper interconnects are used in silicon integrated circuits ics.
Ibm was the first to use copper interconnect technology to produce a chip that used copper wires. In this book, quirk and serda introduce the terminology, concepts, processes, products, and equipment commonly used in the manufacture of ultra large scale integrated ulsi semiconductors. While copper lowk interconnects have served well, allowing for the creation of ultra large scale integration ulsi devices which combine over a billion transistors onto a single chip, the increased resistance and rcdelay at the smaller scale has become a significant factor. Interconnect technology and design for gigascale integration edition 1. Read copper interconnect technology by tapan gupta available from rakuten kobo. Copper interconnect technology pdf free download epdf. The book provides helpful, uptodate technical information about semiconductor manufacturing and strikes an effective balance between the process and equipment technology found in wafer fabrications. This extensive program heritage is the cornerstone for a comprehensive array of highreliability standard products and customsolution capabilities. Hence, cu interconnect technology is used for memory as well as logic circuits for advanced technology nodes. Copper interconnect technology for the 32 nm node and beyond. Advanced metrology for copperlow k interconnects electrical resistance than aluminum, gives a significant boost to interconnect performance. Deposition technologies of materials for cu interconnects.
Resistivity of metal line and thickness of cu barrier layer with technology nodes 40. Copper interconnect technology tapan guptacopper interconnect. Advanced interconnects for ulsi technology wiley online books. We needed copper in the first place to decrease the interconnect resistance, says shyam murarka, core director at the center for advanced interconnect science and technology at rensselaer polytechnic institute, troy, n.
Copper metal for semiconductor interconnects intechopen. Imec presented multiple papers on comparing copper, cobalt and ruthenium interconnect. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of cuinterconnect technology. Copper dual damascene wiring, with lower resistivity than aluminum, is now fully mainstream and will remain the interconnect metal for foreseeable technology nodes. Everyday low prices and free delivery on eligible orders. Cable and interconnect construction the absolute sound. Together, these effects lead to ics with better performance. Copper interconnect technology ebook by tapan gupta. Copper interconnects news newspapers books scholar jstor january 20 learn how and when to remove this template message. Resistancecapacitance rc delay produced by the interconnects limits the speed of the integrated circuits from 0.
Tapan gupta copper interconnect technology tapan gupta since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. Conductors are usually made of copper or silver wire. Although copperlowk technology has become fairly mature, there is no single book available on the promise and challenges of these nextgeneration technologies. With the dual damascene process, a separate via technology is not necessary. In addition, copper interconnect process uses the dual damascene technology for deposition of copper, which can potentially reduce the manufacturing cost by. However, there are many challenges with implementation of cu interconnects at the 32 nm node and beyond, including increased resistivity, integration with porous lowk materials, and reli. Copper cu had been used to replace aluminum al as an interconnecting conductor in order to reduce the resistance. Filed july 30, 1959, solidstate circuits newsletter, ieee, vol. Process technology for copper interconnects sciencedirect. A case study of copper interconnect technology suggests that absorptive capacity exist in three forms.
For over forty years, eatons connectors, cables, and nonexplosive actuators have established a track record of uncompromised reliability in harsh environments ranging from deep sea to deep space. The lengths of the local interconnect are of this order and are comparable to. While the role copper will finally play in nanotechnology is yet to be determined, the metal is already filling a number of notable applications. It is an outstanding reference text that provides an excellent source of information on current copper interconnect technology and.
All this changed in september 1998, when ibm used its revolutionary new copper interconnect technology to produce a chip which used copper wires. Use of copper instead of aluminum for wires in cmos circuits allows more current with less resistance for more efficient chips and about 33% better performance. Lowtemperature dipbased allcopper interconnects formed. However, the performance of this technology is limited by residual porosity of the copper joint formed between the pillar and the pad during sintering. They have a very natural sound compared to straight copper or. Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit a. Ceramic interconnect technology handbook crc press book.